sanken electric co., ltd. http://www.sanken-ele.co.jp/en/ SI-8001FDE description the SI-8001FDE dc voltage regulator is a dc-to-dc buck convertor that attains an oscillation frequency of 300 khz, and has an integrated miniaturized choke coil, allowing it to serve as a small, high efficiency power supply in a compact to263 package. the internal switching regulator function provides high efficiency switching regulation without any need for adjustment. the device requires only six external support components. the optional soft start function requires an additional capacitor. optional on/off control can be performed using a transistor. the SI-8001FDE includes overcurrent and overtemperature protection circuits. applications include: ? dvd recorder ? fpd tv ? telecommunications equipment ? office automation equipment, such as printers ? on-board local power supply ? output voltage regulator for second stage of smps (switched mode power supply) features and benefits ? 3.5 a output current supplied in a small, surface mount power package ? high efficiency: 83% at v in = 15 v, i o = 2.0 a,v o = 5 v ? requires only six external components (optional soft start requires an additional capacitor) ? oscillation circuit built-in (frequency 300 khz typical) ? constant-current mode overcurrent protection circuit and overtemperature protection circuit built-in ? soft start function built-in (can be implemented as an on/off function; output-off state at low level) ? low current consumption during output-off state dc-to-dc step-down converter functional block diagram package: to263-5 not to scale latch and driver overcurrent protection overtemperature protection reference voltage osc reset comparator error amplifier v in 1 3 4 2 v out di c2 c1 gnd adj sw in r1 r2 l1 preg on/off soft start 5 c3 ss di spb-g56s (sanken) 27469.056
2 sanken electric co., ltd. dc-to-dc step-down converter SI-8001FDE 27469.056 all performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature, t a , of 25c, unless oth er wise stated. absolute maximum ratings characteristic symbol remarks rating units dc input voltage v in 43 v power dissipation p d mounted on 40 mm 40 mm exposed copper area on 40 mm 40 mm glass-epoxy pcb; limited by internal overtemperature protection. 3w junction temperature t j internal overtemperature protection circuit may enable when t j 130c. during product operation, recommended t j 125c. ?40 to 150 c storage temperature t stg ?40 to 150 c thermal resistance (junction-to-case) r ? jc mounted on 40 mm 40 mm exposed copper area on 40 mm 40 mm glass-epoxy pcb. 3 c/w thermal resistance (junction-to-ambient air) r ? ja mounted on 40 mm 40 mm exposed copper area on 40 mm 40 mm glass-epoxy pcb. 33.3 c/w selection guide part number output voltage adjustable range (v) efficiency, typ. (%) input voltage, max. (v) output current, max. (a) packing SI-8001FDE-tl 0.8 to 24 83 40 3.5 800 pieces per reel recommended operating conditions* characteristic symbol remarks min. max. units dc input voltage range v in v in (min) is the greater of 4.5 v or v o +3 v. see remarks 40 v dc output voltage range v o 0.8 24 v dc output current range i o v in v o + 3 v; to be used within the allowable package power dissipation characteristics (refer to power dissipation chart). 0 3.5 a operating junction temperature range t jop ?30 100 c operating temperature range t op to be used within the allowable package power dissipation characteristics (refer to power dissipation chart). ?30 85 c *required for normal device functioning according to electrical characteristics table.
3 sanken electric co., ltd. dc-to-dc step-down converter SI-8001FDE 27469.056 si-8000fde (a) v o on/off control only (c) v o on/off and soft start control (b) soft start only c3 ss 5 si-8000fde ss 5 si-8000fde ss 5 system ttl c3 system ttl electrical characteristics 1 , valid at t a = 25c, v o = 5 v (adjusted), r1 = 4.2 k , r1 = 0.8 k characteristic symbol test conditions 1 min. typ. max. units reference voltage v adj v in = 15 v, i o = 0.2 a 0.784 0.800 0.816 v reference voltage temperature coefficient ? v adj / ? tv in = 15 v, i o = 0.2 a, t c = 0 to 100 c ? 0.1 ? mv/c efficiency 2 v in = 15 v, i o = 2 a ? 83 ? % operating frequency f o v in = 15 v, i o = 2 a 270 300 330 khz line regulation v line v in = 10 to 30 v, i o = 2 a ? ? 80 mv load regulation v load v in = 15 v, i o = 0.2 to 3.5 a ? ? 50 mv overcurrent protection threshold current i s v in = 15 v 3.6 ? ? a ss terminal on/off operation threshold voltage v ssl ? ? 0.5 v ss terminal on/off operation outflow current i ssl v ssl = 0 v ? 6 30 a quiescent current 1 i q v in = 15 v, i o = 0 a ? 6 ? ma quiescent current 2 i q(off) v in = 15 v, v ss = 0 v ? 200 600 a 1 using circuit shown in typical application circuit diagram. 2 efficiency is calculated as: (%) = ([ v o i o ] [ v in i in ]) 100. terminal list table name number function in 1 supply voltage sw 2 regulated supply output gnd 3 ground terminal adj 4 terminal for resistor bridge feedback ss 5 the ss terminal is used to enable soft start and to control on/off operation of the ic output, v o (see figure 2). if neither soft start nor on/off control is used, leave pin open. to enable soft start, connect a capacitor between ss and ground. to control on/off operation, connect an npn bipolar transistor, in a ttl open collector output configuration, between the ss terminal and gnd. turn off is done by decreasing v ssl below its rated level. when both soft start and v o on/off are used, a protection measure such as current limiting is required because, if the capacitance of c3 large, the discharge current of c3 flows across the transistor for on/off operation. because a pull-up type resistor is provided inside the ic, no external voltage can be applied. pin-out diagram figure 2. alternative configurations for ss pin. if neither soft start nor v o on/off is required, the ss pin is left open. 12345
4 sanken electric co., ltd. dc-to-dc step-down converter SI-8001FDE 27469.056 90 85 80 75 70 65 60 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 i o (a) (%) 6.00 5.00 4.00 3.00 2.00 1.00 0 5.10 5.08 5.06 5.04 5.02 5.00 4.98 4.96 4.94 4.92 4.90 012345678 v o (v) efficiency versus output current v o = 3.3 v efficiency versus output current v o = 5.0 v efficiency versus output current v o = 12.0 v low voltage behavior: output voltage versus supply voltage 8 v 15 v 40 v 30 v 20 v 01 23 load regulation: output voltage versus output current v o (v) i o (a) 0 2 4 8 6 10 0 10203040 quiescent current versus supply voltage i o = 0 a ss pin open i q (ma) v in (v) v in (v) v in 100 95 90 85 80 75 70 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 i o (a) (%) 8 v 15 v 40 v 30 v 20 v v in i o v in 0 a 0.5 a 1 a 40 v 30 v 15 v 10 v 8 v 2 a 3.5 a 90 85 80 75 70 65 60 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 i o (a) (%) 15v 40 v 30 v 20 v v in v in 15 v 8 v 30 v 40 v behavior at turn-off: quiescent current versus input voltage i o = 0 a v ss = 0 v 0 2 1 3 5 4 6 0123 5 4 overcurrent protection: output voltage versus output current v o (v) i o (a) 400 300 200 100 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 v in (v) i q ( a) performance characteristics at t a = 25c, v o = 5 v adjusted, r1 = 4.2 k , r2 = 0.8 k
5 sanken electric co., ltd. dc-to-dc step-down converter SI-8001FDE 27469.056 thermal performance characteristics 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 ?25 0 25 50 75 100 125 power dissipation versus ambient temperature t j (max) = 125c; mounted on glass-epoxy pcb (40 mm 40 mm), with varying exposed copper areas p d (w) t a (c) cu area: 1600 mm 2 r ja = 33.3c/w cu area: 800 mm 2 r ja = 37c/w cu area: 400 mm 2 r ja = 44c/w cu area: 100 mm 2 r ja = 53c/w device thermal resistance versus exposed copper area on pcb glass-epoxy pcb, 40 mm 40 mm copper area (mm 2 ) 55 50 45 40 35 30 0 800 1000 1200 1400 1600 200 400 600 1800 r ja (c/w) 6 5 4 3 2 1 0 0 20 40 60 80 100 120 140 180 160 t j (c) v o (v) overtemperature protection: output voltage versus junction temperature v in = 15 v, i o = 10 ma otp on otp off the application must be designed to ensure that the t j (max) of the device is not exceeded during operation. to do so, it is necessary to determine values for maximum power dissipation, p d (max), and ambient temperature, t a (max). the relationships of t j , p d , t a , and case temperature, t c , are as shown in the following formulas: t j ? t c r jc p d = t j ? t a r ja p d = and . p d can be calculated from input values: ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? = in o o f x o o d v v i v i v p 1 1 100 h where: v o is output voltage in v, v in is input supply voltage in v, i o is output current in a, x is ic efficiency in percent (varies with v in and i o ; refer to efficiency performance curves for value), and v f is forward voltage for the input diode, di. in these tests, the sanken spb-g56s was used, at 0.4 v. for application design, obtain thermal data from the datasheet for the diode. p d is substantially affected by the heat conductance properties of the application, in particular any exposed copper area on the pcb where the device is mounted. the relationships of p d , t a , and copper area is represented in the power dissipation chart. r ja for a given copper area can be determined form the device thermal resistance chart. this can be substituted into the formula above to determine the t j (max) allowable in the application. generally, more than 10% to 20% derating is required. because the heat dissipation capacity of the copper area depends substantively on how it is used in the actual application, thermal characteristics of the application must be confirmed by testing. t c is determined by connecting a thermocouple to the device as shown here: thermocouple mount at tab center and analyzing the results using the following formula: t j = p d r jc + t c , for this device, r jc is 3 c/w.
6 sanken electric co., ltd. dc-to-dc step-down converter SI-8001FDE 27469.056 component selection v in 1 gnd gnd 2 4 3 gnd ss in sw adj c1 c2 l1 di v o r1 r2 i adj 5 c3 soft start only SI-8001FDE component rating c1 470 f c2 680 f c3 0.1 f (for soft start function) di spb-g56s (sanken) l1 47 h all external components should be mounted as close as possible to the SI-8001FDE. the ground of all components should be connected at one point near gnd pin (pin 3). recommended pcb layout recommended solder pad layout typical application diagram diode di a schottky-barrier diode must be used for di. if other diode types are used, such as fast recovery diodes, the ic may be destroyed because of the reverse voltage applied by the recovery voltage or on voltage. choke coil l1 if the winding resistance of the choke coil is too high, the efficiency may be reduced below rating. because the overcurrent protection start current is approximately 4.2 a, atten- tion must be paid to the heating of the choke coil by magnetic saturation due to overload or short-circuited load. capacitors c1, c2, and c3 because for smps, large ripple currents flow across c1 and c2, capacitors with high frequency and low impedance must be used. if the impedance of c2 is too high, the switching waveform may not be normal at low tempera- tures. do not use either os or tantalum types of capacitors for c2 or c3, because the extremely low esr causes an abnormal oscillation. the device is stabilized, and for proper operation, c1 must be located close to the device (see layout diagram, below). c3 is required only if the soft start function is used. if not using soft- start, leave the ss terminal open. a pull-up resistor is provided inside the ic. resistor bridge r1 and r2 comprise the resistor bridge for the output voltage, v o , and are calculated as follows: () () ) , and ( () == = ? = ? = ? ? k i v r2 v i v v r1 adj adj o adj adj o 8 . 0 10 1 8 . 0 10 1 8 . 0 3 3 i adj should always be set to 1 ma. note that r2 should always be present to ensure stable operation, even if v o , is set to 0.8 v (that is, even if there is no r1). v o should be at least v in + 8%. 6.80.1 110.2 90.2 90.1 3.70.05 40.1 1.70.1 10.05 (mm)
7 sanken electric co., ltd. dc-to-dc step-down converter SI-8001FDE 27469.056 (r0.45) 2.00 0.10 1.30 +0.10 ?0.05 branding xxxxxxxx xxxxxxxx xxxxxxxx xxxxxxxx dimensions do not include mold protrusion heastsink side flash: 0.8 mm maximum dimensions in millimeters branding codes (exact appearance at manufacturer discretion): 1st line: sk 2nd line, lot: ymw x where: y is the last digit of the year of manufacture m is the month ( 1 to 9, o, n, d ) w is the week of the month ( 1 to 5 ) x is the device subtype suffix number 3rd line, type: 8001fde 12345 4p1.70 0.25 (4.40) (8.00) 9.90 0.20 10.00 0.02 3xr0.30 3xr0.30 ?1.5 0.20 4.50 0.20 0.10 0.15 (0.75) (4.60) 0.88 0.10 0.80 0.10 9.20 0.20 (6.80) 2.20 0.20 15.30 0.30 4.90 0.20 (0.50) 2.54 0.30 2.40 0.20 (r0.30) (0.75) (0.40) + + 2xr0.30 6o 0o 3o 3o 3o 3o 15o package outline drawing rohs directive compliant device pins lead (pb) free
8 sanken electric co., ltd. dc-to-dc step-down converter SI-8001FDE 27469.056 cautions for use ? operation of the product in parallel to increase current is not permitted. ? although the product has an internal overtemperature protection circuit, that is intended only to protect the product from temporary excess heating due to overloads. long-term reliability cannot be guaranteed when the product is operated under continuous overload conditions. because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. cautions for storage ? ensure that storage conditions comply with the standard temperature (5c to 35c) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. ? avoid locations where dust or harmful gases are present and avoid direct sunlight. ? reinspect for rust on leads and solderability of products that have been stored for a long time. cautions for testing and handling when tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between adjacent products, and shorts to the heatsink. electrostatic discharge ? when handling the products, operator must be grounded. grounded wrist straps worn should have at least 1 m of resistance to ground to prevent shock hazard. ? workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. ? when using measuring equipment such as a curve tracer, the equipment should be grounded. ? when soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products. ? the products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil. soldering ? when manually soldering the products, please be sure to minimize the working time, within the following limits: soldering iron temperature (c) time (s) 38010 3 (once only) ? reflow s oldering can be performed a maximum of twice, using the following recommended profile: 230 30 10s 90 30s 180 150 250 time temperature (c) 250c maximum
9 sanken electric co., ltd. dc-to-dc step-down converter SI-8001FDE 27469.056 ? the contents in this document are subject to changes, for improvement and other purposes, without notice. make sure that this is the latest revision of the document before use. ? application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod- ucts herein and sanken can assume no responsibility for any infringement of industrial property rights, intellectual property r ights or any other rights of sanken or any third party which may result from its use. ? although sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of se micon- ductor products at a certain rate is inevitable. users of sanken products are requested to take, at their own risk, preventativ e measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. ? sanken products listed in this document are designed and intended for the use as components in general purpose electronic equ ip- ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). when considering the use of sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales representative to discuss, prior to the use of the products herein. the use of sanken products without the written consent of sanken in the applications where extremely high reliability is requi red (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. ? in the case that you use sanken products or design your products by using sanken products, the reliability largely depends on the degree of derating to be made to the rated values. derating may be interpreted as a case that an operation range is set by dera ting the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. in general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stres ses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. for these stress es, instantaneous values, maximum values and minimum values must be taken into consideration. in addition, it should be noted that since power devices or ic's including power devices have large self-heating value, the de gree of derating of junction temperature affects the reliability significantly. ? when using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, ch emically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ? anti radioactive ray design is not considered for the products listed herein. ? sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of sanken's dis tribu- tion network. ? the contents in this document must not be transcribed or copied without sanken's written consent.
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